Rapid Thermal Anealing

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RTP-100
RTP-150
RTP -200
VPO-300
Spécifications

Rapid Thermal Annealing oven RTP-100

Rapid Thermal Annealing Vacuum oven  for up to 4“ wafer size

The RTP oven is perfect for

  • a wide variety of applications in  Semiconductor manufacturing
  • Dopant activation
  • Thermal oxidation
  • Metal reflow and chemical vapor  deposition

Rapid Thermal Annealing oven RTP-150

Rapid Thermal Annealing Vacuum oven  for up to 6“ wafer size

The RTP oven is perfect for

  • a wide variety of applications in  Semiconductor manufacturing
  • Dopant activation
  • Thermal oxidation
  • Metal reflow and chemical vapor  deposition

Rapid Thermal Annealing oven RTP-200

Rapid Thermal Annealing Vacuum oven for up to 8“ wafer size

The RTP oven is perfect for

  • a wide variety of applications in  Semiconductor manufacturing
  • Dopant activation
  • Thermal oxidation
  • Metal reflow and chemical vapor  deposition

Vacuum Process Oven VPO-300

Vacuum Process Oven for up to 12“ wafer size

The VPO-1000-300 vacuum process oven is suitable for performing different  processes:

  • Rapid heating up of Si wafers (using quartz glass holder)
  • Rapid heating up of GaAs, GaN and sapphire substrates (using graphite  susceptor)
  • The customer is in charge of process development and evaluation. UniTemp  can consult the customer in this case.

Technical Specifications

Rapid Thermal Annealing ovens - overview
Vacuum up to 1x10-3 hPa RTP-100 RTP-150 RTP-200 VPO-300
Vacuum up to 5x10-6 hPa RTP-100-HV RTP-150-HV RTP-200-HV VPO-300-HV
max. Wafer size 100 mm dia or 150 mm dia or 200 mm dia or 300 mm dia or
Graphite susceptor (i.d.) 106 x 106 x 1.75 mm³ 157 x 157 x 2 mm³ 206 x 206 x 1 mm³ 206 x 206 x 1 mm³
Graphite crucible (i.d.) Dia 90 mm x 8 mm 134 x 134 x 11 mm³ 201 x 201 N/A
max. Temperature 1000 °C (1500 °C) 1000 °C (1200 °C) 1000 °C (1200 °C) 1000 °C (1200 °C)
Max. ramp up rate (applied to single SI wafer) 150 K/sec (200 K/sec) 75 K/sec (150 K/sec) 50 K/sec (100 K/sec) 40 K/sec
Max. cool Down rate 1000 °C > 400 °C up to 200 K/min up to 200 K/min up to 200 K/min up to 200 K/min
IR- Infrared lamps 18 (20 kW) 24 (21 kW) 24 (21 kW) 24 (2x18 kW)
Top and bottom heating (selectable) yes yes yes yes
Zone Control yes yes yes yes
Process Gas lines MFC (max. 4 pcs). MFC (max. 4 pcs). MFC (max. 4 pcs). MFC (max. 4 pcs).