We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.
Reflow solder systems
mini table top reflow solder systems from 110x110mm up 210x210mm heating area and Vacuum Solder System for substate size up to 600x600mm (also for automatic loading, vertical opening by push button)
Rapid Thermal Anealing
Rapid thermal annealing furnaces for processing individual 4- to 8-inch wafers and a vacuum processing furnace for processing 300 mm wafers.
Wire bonding
Semiautomatic Wire Bonder for gold and aluminium with 3 motorized axis, mouse controlled
