PM6
The PM6 Precision Lapping & Polishing system produces results typically found on production scale equipment. Highly flexible in use, the PM6 allows users to work with many different materials including; gallium arsenide, silicon, rock and soils. This system provides the ability to produce specimens repeatably with superior quality and surface finish. Precise plate set-up options com- bined with an intuitive control system provide an effortless consistency of results with a very high degree of accuracy.
Description
Wherever there is a need for a controlled flat surface with a high quality finish the PM6 makes an invaluable investment. The PM6 system offers enhanced process performance through a combination of innovative designs and intuitive operator controls.
Specifications
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Wafer Capacity: 1) PP5 Jigs |
1) x1 PP5 jigs (up to 75mm/3” wafers bonded to a 83mm support substrate per PP5 jig) OR x1 PP5 Jigs + Automatic Plate Flatness Monitor 2) x1 PP6 jigs (up to 100mm/4” wafers bonded to a 112mm support substrate per PP6 jig) OR x1 PP6 Jigs + Automatic Plate Flatness Monitor 3) x1 PLJ2 / VCB2 jig (from 6 x 28x48mm up to 1 x 110x75mm per PLJ2 / VCB2 jig) or x 1 PLJ2 + Automatic Plate Flatness Monitor 4) x1 WG6 Polishing Head (from 6 x 28x48mm slides up to 3 X 51x76mm slides per WG6 head) |
| Height | 965mm |
| Width | 800mm |
| Depth | 720mm |
| Power Supply | 240v/110v Single Phase |
| Plate Diameter | 300mm |
| Plate Speed | 5-100rpm |
| Abrasive Delivery | Up to two 2L Cylinder, measured flow 1-100ml/min delivered via peristaltic pumps and slurry chute |
| Colloidal Delivery | 1-100ml/min delivered via peristaltic pumps and slurry chute |
| Machine Weight | 130 kg |