DL81/DL82 Precision Lapping and Polishing System

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DL81/DL82

Delivering the ultimate in processing innovations, the DL series is Logitech’s newest, highly automated, and intelligent sample preparation system. Featuring dynamic load control with Logitech’s intelligent air jigs, the system ensures fast, reliable, and highly accurate results across a wide range of materials used in semiconductor wafer processing, from soft, friable materials like Indium Phosphide (InP) and Gallium Arsenide (GaAs) to very hard materials such as Silicon Carbide (SiC) and Diamond.

Description
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Spécifications
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Description

The advanced automation significantly reduces setup and cleanup time, while the integrated software offers a user-friendly platform for precise, controlled processing. Logitech’s intelligent air-driven jigs utilize air pressure to apply up to 40kg of downforce on the chuck, achieving rotational speeds of up to 100 rpm, ensuring optimal sample load application. This enables high geometric accuracy, consistent sample rotation, and excellent wafer uniformity, resulting in repeatable, high-quality results throughout the process.

Specifications

Jig Capacity DL81 1 x Air Jig - up to 8"/200 mm capacity
Jig Capacity DL82 2 x Air Jigs simultaneously - each up to 8"/200 mm capacity
Jig Options AJ200 - 8"/200 mm | AJ150 - 6"/150 mm | AJ100 - 4"/100 mm
Jig Speed 100 rpm
Height 1975 mm
Jig Load Range 2 - 40 kg
Width 1639 mm
Depth 1141 mm
Power Supply Single Phase, Earth ac. 220-240V 32 Amps
Plate Diameter Up to 700 mm
Plate Speed 100 rpm
Plate Direction CCW
Slurry Flow Rate 5-100 ml/per minute
Wafer Sizes 2”, 3”, 4”, 6” and 8” single
Exhaust Port 150 mm OD
Slurry Waste Logiwaste Integrated Sealed System

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