CMP Orbis
The CMP Orbis is a precision engineered, floor standing Chemical Mechanical Polishing (CMP) system ideally suited for R&D environments where the main purpose or application is to conduct pilot production tests with optimum analytical capabilities and enhanced process performance.
Description
The CMP Orbis has been designed to be readily adaptable as an enabling technology in preproduction testing, though it also has the ability to suit a range of processing uses. The highly adaptable system can be utilised for back-end IC manufacturing, Micro- Electromechanical Systems (MEMS) fabrication, Opto-MEMS and Bio-MEMS fabrication.
Achieve laser quality surfaces with Ra to sub-nanometer levels of material removal across a wide range of materials.
Specifications
| Carrier Sizes Available | 100 mm (4”) Wafer / 150 mm (6”) Wafer / 200mm(8”) Wafer |
| Height | 1950 mm |
| Depth | 735 mm – 785 mm (including front bar) |
| Width | 1680 mm (2050 mm with screen extended) |
| Power Supply | Single Phase, Neutral, Earth. 220v – 240v |
| Fuse Rating | 25A RCBO |
| Plate Speed | 0-160 rpm |
| Plate Diameter | 600 mm |
| Plate Rotation | Forward & Reverse direction settings |
| Carrier Speed | 10-125 rpm |
| Carrier Back Pressure | 0 - 50 psi |
| Carrier Down Pressure | Min: 0.4 psi / 2.8 kPa / Max: load 9 psi / 62 kPa |
| Machine Weight | 590 kg |
| Gross Packed Weight | 830 kg |
| Slurry Flow Rate | 20 – 500 ml/min |
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