WB-300-U Wire Bonder for ball and wedge
Application
- Wedge and ball bonding with 3 motorized axis
- With gold or aluminum wire
- Motorized Deep Access bond head Z-axis 50 mm
- Accuracy 1.0 μm
- Bond arm length 165 mm
- Motorized X-Y-table (250 mm diameter, 50 mm x 50mm travelling distance)
- Fine table motion 50 mm x 50 mm
- Component separation during thermal processing in 2 temperature zones
Unique selling point: MOUSE controlled motion! (in the range of a table top R&D wire bonder!
WB-300-U Technical Data / Options
| WB-300-U | |
| Bonding method | Wedge, ball, ribbon |
| Wire | Gold or aluminium , 17µm-50µm (others on request), ribbon (on request) |
| Bond arm length | 165 mm |
| Transducer | 62 kHz or 102 kHz |
| Dimension/weight | 296 mm x 570 mm x 490 mm, 38 kg |
| Hot chuck | 60mm or 100mm heating area, with vacuum hold and clamp holder |
| Optics | Either standard microscope or vertical camera system, both simultaneously possible |