Reflow Solder System RSS-110-S
Applications / Reflow Solder System as table top version
- Reflow Solder Processes (flux-less)
- Lead free and void free soldering
Operation with inert gas, Oxygen gas, Hydrogen gas, Forming gas, Formic Acid (depends on model) - Flip chip process
- Adhesive bonding
- Solder bump reflowing
- Encapsulation of housings
- Soldering of power devices
- Heat treatment of semiconductor wafers
- Prototype development
- Quality control
Specification RSS-110-S (including options and accessories)
| Max. substrate size | 110 x 110 mm² |
| Max. temperature | up to 400 °C, optionally up to 500 °C |
| T continuous | 400 °C |
| Ramp up rate | 120 K/min |
| Ramp down rate | up to 180 K/Min. |
| Substrate cooling | - |
| Chamber cooling | - |
| Vacuum | up to 10-³ hPa, integrated pressure sensor |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | 40 mm, optionally 80 mm |
| Programs | 50 programs can be stored |
| Formic acid module | 30 ml vessel, to be filled manually |
| Hydrogen module | on request |
| USB Camera | - |
| Dimension | 260 x 420 x 220 mm |
| Weight | 10 kg |
| Power | 230 V/1,6 kW ou 115 V/1,2 kW |
Reflow Solder System RSS-160-SC
Mini Vacuum Reflow System with SIMATIC© control for substrate size up 160 x 160 mm²
The reflow solder system is perfect for the following applications:
- Flux-less soldering
- Flip chip process
- Adhesive bonding
- Solder bump reflowing
- Encapsulation of housings
- Soldering of power devices
- Heat treatment of semiconductor wafers
- Prototype development
- Quality control
Specification RSS-160-SC (including options and accessories)
| Max. substrate size | 160 x 160 x 65 (70) mm² |
| Max. temperature | Up to 400 °C |
| T continuous | 400 °C (optional up to 500°C) |
| Ramp up rate | 100 K/Min. |
| Ramp down rate | Up to 100 K/Min. |
| Substrate cooling | Water cooled |
| Chamber cooling | Water cooled channels |
| Vacuum | up to 10-³ hPa, integrated pressure sensor |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | 70 mm |
| Programs | 50 programs can be stored |
| Formic acid module | 30 ml vessel, to be filled manually |
| Hydrogen module | on request |
| USB Camera | Process viewing by USB camera system on top |
| Dimension | 365 x 520 x 275 mm³ |
| Weight | 25 kg |
| Power | 230V/2.4 kW, 200V/2.0 kW, 115V/1.8 kW |
Reflow Solder System RSS-210-S
Applications / Reflow Solder System as table top version
- Reflow Solder Processes (flux-less)
- Lead free and void free soldering
Operation with inert gas, Oxygen gas, Hydrogen gas, Forming gas, Formic Acid (depends on model)
- Flip chip process
- Adhesive bonding
- Solder bump reflowing
- Encapsulation of housings
- Soldering of power devices
- Heat treatment of semiconductor wafers
- Prototype development
- Quality control
Specification RSS-210-S (including options and accessories)
| Max. substrate size | 210 x 210 mm² |
| Max. temperature | Up to 400 °C, optionally up to 500 °C |
| T continuous | 400 °C |
| Ramp up rate | 180 K/Min. |
| Ramp down rate | Up to 120 K/Min. |
| Substrate cooling | - |
| Chamber cooling | - |
| Vacuum | Up to 10³ hPa, integrated pressure sensor |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | 60mm, optionally 80 mm |
| Programs | 50 programs storable |
| Formic acid module | 30 ml vessel, to be filled manually |
| Hydrogen module | on request |
| USB Camera | on request |
| Dimension | 330 x 610 x 290 mm³ |
| Weight | 23 kg |
| Power | 3~+N+PE/Y/230 V/9 kW or 3~+PE/Δ/200 V/7 kW |
Compact Reflow Solder System RSS-3x210
Applications
The RSS-3X210 Reflow Solder System is an excellent tool for various solder processes up to 100 mm diameter wafer (12 pcs in one run). Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series
- Reflow Solder Processes without flux
- Operation with inert gas, Oxygen, Hydrogen, Forming gas, Formic Acid
- Lead free soldering
- Resistor paste firing
Specification RSS-3x210-S (including options and accessories)
| Max. substrate size | 3 heated plates each 210 x 210 mm |
| Max. temperature | Up to 300 °C |
| T continuous | 300 °C |
| Ramp up rate | 120 K/Min. |
| Ramp down rate | T=300°C > 200°C: 90 K/min |
| Substrate cooling | By external water cooler |
| Chamber cooling | By external water cooler |
| Vacuum | Up to 10³ hPa |
| Flow meter | Mass Flow Controller for process gas Nitrogen 5 nlm |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | Height: 30mm (option: 80 mm) / Area: 210 x 630 mm² |
| Programs | 50 programs storable |
| Formic acid module | 30 ml vessel, to be filled manually |
| Hydrogen module | on request |
| USB Camera | on request |
| Dimension | 820 x 630 x 315 mm³ |
| Weight | 100 kg |
| Power | CEE 3x32 A, 230 V, 3~ + N + PE |
Reflow Solder Oven with Vacuum RSO-210
Applications
The RSO-210 Reflow Solder System is an excellent tool for various solder applications up to 210 x 210 mm or 8” wafer substrate size. Many reflow soldering applications require an inert process area (oxygen free) within the reflow oven. The gas used to purge the chamber of oxygen is typically nitrogen. The two advantages of a nitrogen inert reflow process are as follows: Nitrogen replaces oxygen, and due to its inert (non-reactive) nature it provides greater profile flexibility and widens the process window. Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series.
- Reflow Solder Processes without flux
- Operation with inert gas, Oxygen, Hydrogen, Forming gas, Formic Acid
- Lead and Lead-free SMT reflow
- High temperature ceramic/alumina hybrid reflow
- Pin-in-paste reflow
- Semiconductor
- LED attach
Specification RSO-210 or RSO-210-HV (including options and accessories)
| Max. substrate size | 210 x 210 mm |
| Max. temperature | Up to 650 °C |
| T continuous | 650 °C |
| Ramp up rate | 10 K/sec |
| Ramp down rate | T=650°C > 400°C: 200 K/min T=400°C > 100°C: 30 K/min |
| Substrate cooling | By nitrogen gas |
| Chamber cooling | By external water cooler |
| Vacuum | Up to 10³ hPa (optional 10-6 hPa) |
| Flow meter | Mass Flow Controller for process gas Nitrogen 5 nlm |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | 40 mm |
| Programs | 50 programs storable |
| Formic acid module | Optional |
| Hydrogen module | on request |
| USB Camera | on request |
| Dimension | 630 x 580 x 580 mm³ (W x D x H) |
| Weight | 60 kg |
| Power | 3 x 400 V, 3P, +N+PE, 11kW |
Reflow Solder Oven with Vacuum RSO-300
Applications
The RSO-300 Reflow Solder System is an excellent tool for various solder applications up to 309 mm x 319 mm x 40 mm substrate size. Many reflow soldering applications require an inert process area (oxygen free) within the reflow oven. The gas used to purge the chamber of oxygen is typically nitrogen. The two advantages of a nitrogen inert reflow process are as follows: Nitrogen replaces oxygen, and due to its inert (non-reactive) nature, provides greater profile flexibility and widens the process window. Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series.
- Reflow Solder Processes without flux
- Operation with inert gas, Oxygen, Hydrogen, Forming gas, Formic Acid
- Lead and Lead-free SMT reflow
- High temperature ceramic/alumina hybrid reflow
- Pin-in-paste reflow
- Semiconductor
- LED attach
Specification RSO-300 (including options and accessories)
| Max. substrate size | 300 x 300 x 40 mm |
| Max. temperature | Up to 650 °C |
| T continuous | 650 °C |
| Ramp up rate | 10 K/sec |
| Ramp down rate | T=650°C > 400°C: 200 K/min T=400°C > 100°C: 30 K/min |
| Substrate cooling | By nitrogen gas |
| Chamber cooling | By external water cooler |
| Vacuum | Up to 10³ hPa |
| Flow meter | Mass Flow Controller for process gas Nitrogen 5 nlm |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Aluminium |
| Chamber height inside | 40 mm |
| Programs | 50 programs storable |
| Formic acid module | Optional |
| Hydrogen module | on request |
| USB Camera | on request |
| Dimension | 578 x 496 x 570 mm³ (W x D x H) |
| Weight | 70 kg |
| Power | 3 x 400V 21 kW/3x200V/24kW/3x208V/20kW |
Vacuum Soldering System VSS-300
Applications
Reflow Solder Processes with or without vacuum up to 10-6 hPa. Easy profiling by using a SPS SIMATIC® Controller with WIN based software. Perfect lab tool and also for production on a low cost base. High production output. A remote control can be adjusted and the system can easily integrated into a production line.
- Reflow Solder Processes with flux
- Operation with inert gas, Oxygen, Forming gas, Formic Acid
- Lead and Lead-free SMT reflow
- Resistor paste firing
Specification VSS-300 (including options and accessories)
| Max. substrate size | 300 x 300 mm or 12” wafer |
| Max. temperature | Up to 450 °C, higher temperature on request |
| T continuous | 450 °C |
| Ramp up rate | 150 K/Min. |
| Ramp down rate | T = 450 °C > 200 °C: 90 K/min, T = 200 °C > 100 °C: 60 K/min |
| Substrate cooling | By nitrogen gas |
| Chamber cooling | By external water cooling system |
| Vacuum | Up to 10³ hPa optionally up to 10³ hPa) |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Isostatic graphite |
| Chamber height inside | 75 mm, optionally 120 mm (incl. 65 mm window) |
| Programs | 50 programs storable |
| Formic acid module | Optional, also with refilling upgrade |
| Hydrogen module | Optional with safety hood |
| USB Camera | Optional |
| Dimension | 550 x 690 x 980 mm³ |
| Weight | 120 kg |
| Power | 3x400V 18kW/3x200V 18 kW / 3x208V 15 kW |
Vacuum Soldering System VSS-650
coming soon
Specification VSS-650 (including options and accessories)
| Max. substrate size | 600 x 600 mm |
| Max. temperature | Up to 450 °C, higher temperature on request |
| T continuous | 450 °C |
| Ramp up rate | 240 K/Min. |
| Ramp down rate | T = 450 °C > 200 °C: 90 K/min, T = 200 °C > 100 °C: 60 K/min |
| Substrate cooling | By nitrogen gas |
| Chamber cooling | By external water cooling system |
| Vacuum | Up to 10³ hPa optionally up to 10³ hPa) |
| Flow meter | Mass Flow Controller for Nitrogen and other inert gases |
| Gases | Inert gases, other on request |
| Controller | SIMATIC© with 7" Touch Panel |
| Heating plate | Isostatic graphite |
| Chamber height inside | 50 mm, optionally 100 mm |
| Programs | 50 programs storable |
| Formic acid module | Optional, also with refilling upgrade |
| Hydrogen module | Optional with safety hood |
| USB Camera | Optional |
| Dimension | 900 x 900 x 1530 mm³ |
| Weight | 480 kg |
| Power | 3x400V 18kW/3x200V 18 kW / 3x208V 15 kW |