LP70
This bench-top machine is designed to run concurrent automated processes, allowing operators to achieve repeatable results to stringent sample specifications. With four workstations as standard, this system is the optimal solution for both production environments and research laboratories.
Description
Intuitive features with improved functionality allows for increased material removal rates, with greater levels of control and reliable process repeatability.
Specifications
|
Wafer Capacity: 1) PP5 Jigs |
1) x4 PP5 Jigs (up to 75mm/3” wafers bonded to a 83mm support substrate per PP5 jig) OR x3 PP5 Jigs + Automatic Plate Flatness Monitor 2) x4 PP6 Jigs (up to 100mm/4” wafers bonded to a 112mm support substrate per PP6 jig) OR x3 PP6 Jigs + Automatic Plate Flatness Monitor 3) x2 PP8 Jigs (up to 150mm/6” wafers bonded to a 160mm support substrate per PP8 jig) + Automatic Plate Flatness Monitor 4) x4 PLJ2 / VCB2 Jigs (from 6 x 28x48mm up to 1 x 110x75mm per PLJ2 / VCB2 jig) OR x 3 PLJ2 + Automatic Plate Flatness Monitor 5) x2 (from 14 x 28x48mm slides up to 1 x 100x150mm slides per PLJ7 / VCB7 jig) + Automatic Plate Flatness Monitor 6) x2 (from 6 x 28x48mm slides up to 3 x 51x76mm slides per WG6 head) |
| Height | 990 mm |
| Width | 950 mm |
| Depth | 730 mm |
| Power Supply | 240v/110v Single Phase |
| Plate Diameter | 400mm |
| Plate Speed | 5-100rpm |
| Abrasive Delivery | Up to two 2L Cylinder, measured flow 1-100ml/min delivered to all four stations via peristaltic pumps and slurry chute |
| Colloidal Delivery | 1-100ml/min delivered to all four stations via peristaltic pumps and slurry chute |
| Machine Weight | 160kg |