CMP Tribo
The Logitech CMP Tribo is a bench-top chemical mechanical polishing (CMP) system designed with the research of wafer processes in mind, including their associated wafer, pad and slurry interactions. Primary application areas for the CMP Tribo are in the field of CMP planarization or delayering, with secondary application in the field of Tribological science and research.
Description
The CMP Tribo achieves industry standards in control and layer removal for CMP and produces laser quality surfaces (0/0 scratch dig), making improvements to surface topography. The system can achieve nanometer level material removal on a wide range of wafers/ substrates used in today’s device fabrication processes.
A highly versatile system, the CMP Tribo can be tailored through the use of different carrier heads, polishing templates, wet bench modules or end point detection.
Specifications
| Wafer Capacity: | Up to 100 mm/4” |
| Height | 1150 mm |
| Depth | 800 mm – 985 mm (including screen) |
| Width | 1240 mm – 1380 mm (including pipes) |
| Power Supply | 220v - 240v Single inlet 16Amps - 50/60Hz |
| Plate Speed | 0 - 100 rpm |
| Plate Diameter | 400 mm |
| Plate Rotation | CW & CCW |
| Carrier Speed | 10 -100 rpm |
| Carrier Back Pressure | 0 - 50 psi / 344k Pa |
| Carrier Down Pressure | 0.4 psi / 2.8 kPa Max: load 9 psi / 62 kPa |
| Machine Weight | 260 kg |
| Slurry Flow Rate | 20 - 500ml/min |
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